Analysis of Folded H-Plane Tee Junction Using Multiple Cavity Modeling Technique

Debendra Kumar Panda, Ajay Chakraborty. Analysis of Folded H-Plane Tee Junction Using Multiple Cavity Modeling Technique. In IEEE Reglon 10 Colloquium and Third International Conference on Industrial and Information Systems, ICIIS 2008, Kharagpur, India, December 8-10, 2008. pages 1-6, IEEE, 2008. [doi]

Abstract

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