YangSub Park, KilBum Kang, Sang-Yun Yun, SeongSoo Kim. The Method to Measure Si Thickness for Bond Line Thickness. In Maria De Marsico, Gabriella Sanniti di Baja, Ana L. N. Fred, editors, Proceedings of the 7th International Conference on Pattern Recognition Applications and Methods, ICPRAM 2018, Funchal, Madeira - Portugal, January 16-18, 2018. pages 273-275, SciTePress, 2018. [doi]
Abstract is missing.