Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim. Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
Abstract is missing.