Vladimir Pasca, Lorena Anghel, Claudia Rusu, Riccardo Locatelli, Massimo Coppola. Error resilience of intra-die and inter-die communication with 3D spidergon STNoC. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 275-278, IEEE, 2010. [doi]
Abstract is missing.