Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh. Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
Abstract is missing.