7.6 A 512×424 CMOS 3D Time-of-Flight image sensor with multi-frequency photo-demodulation up to 130MHz and 2GS/s ADC

Andrew D. Payne, Andy Daniel, Anik Mehta, Barry Thompson, Cyrus S. Bamji, Dane Snow, Hideaki Oshima, Larry Prather, Mike Fenton, Lou Kordus, Patrick O'Connor, Rich McCauley, Sheethal Nayak, Sunil Acharya, Swati Mehta, Tamer A. Elkhatib, Thomas Meyer, Tod O'Dwyer, Travis Perry, Vei-Han Chan, Vincent Wong, Vishali Mogallapu, William Qian, Zhanping Xu. 7.6 A 512×424 CMOS 3D Time-of-Flight image sensor with multi-frequency photo-demodulation up to 130MHz and 2GS/s ADC. In 2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014. pages 134-135, IEEE, 2014. [doi]

Abstract

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