Andrew D. Payne, Andy Daniel, Anik Mehta, Barry Thompson, Cyrus S. Bamji, Dane Snow, Hideaki Oshima, Larry Prather, Mike Fenton, Lou Kordus, Patrick O'Connor, Rich McCauley, Sheethal Nayak, Sunil Acharya, Swati Mehta, Tamer A. Elkhatib, Thomas Meyer, Tod O'Dwyer, Travis Perry, Vei-Han Chan, Vincent Wong, Vishali Mogallapu, William Qian, Zhanping Xu. 7.6 A 512×424 CMOS 3D Time-of-Flight image sensor with multi-frequency photo-demodulation up to 130MHz and 2GS/s ADC. In 2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014. pages 134-135, IEEE, 2014. [doi]
@inproceedings{PayneDMTBSOPFKO14,
title = {7.6 A 512×424 CMOS 3D Time-of-Flight image sensor with multi-frequency photo-demodulation up to 130MHz and 2GS/s ADC},
author = {Andrew D. Payne and Andy Daniel and Anik Mehta and Barry Thompson and Cyrus S. Bamji and Dane Snow and Hideaki Oshima and Larry Prather and Mike Fenton and Lou Kordus and Patrick O'Connor and Rich McCauley and Sheethal Nayak and Sunil Acharya and Swati Mehta and Tamer A. Elkhatib and Thomas Meyer and Tod O'Dwyer and Travis Perry and Vei-Han Chan and Vincent Wong and Vishali Mogallapu and William Qian and Zhanping Xu},
year = {2014},
doi = {10.1109/ISSCC.2014.6757370},
url = {https://doi.org/10.1109/ISSCC.2014.6757370},
researchr = {https://researchr.org/publication/PayneDMTBSOPFKO14},
cites = {0},
citedby = {0},
pages = {134-135},
booktitle = {2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014},
publisher = {IEEE},
isbn = {978-1-4799-0918-6},
}