Dynamic temperature-aware reliability modeling for multi-branch interconnect trees

Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan. Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. In Yajie Qin, Zhiliang Hong, Ting-Ao Tang, editors, 12th IEEE International Conference on ASIC, ASICON 2017, Guiyang, China, October 25-28, 2017. pages 92-95, IEEE, 2017. [doi]

Abstract

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