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Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan. Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. VLSI Syst., 26(2):239-248, 2018. [doi]
Abstract is missing.