Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Jussi Putaala, Jari Hannu, Esa Kunnari, Matti Mäntysalo, Olli Nousiainen, Heli Jantunen. Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors. Microelectronics Reliability, 54(1):272-280, 2014. [doi]

@article{PutaalaHKMNJ14,
  title = {Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors},
  author = {Jussi Putaala and Jari Hannu and Esa Kunnari and Matti Mäntysalo and Olli Nousiainen and Heli Jantunen},
  year = {2014},
  doi = {10.1016/j.microrel.2013.08.021},
  url = {http://dx.doi.org/10.1016/j.microrel.2013.08.021},
  researchr = {https://researchr.org/publication/PutaalaHKMNJ14},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {54},
  number = {1},
  pages = {272-280},
}