Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, F. Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka. Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-6, IEEE, 2010. [doi]

Abstract

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