Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc. 3D Integration technology: Status and application development. In 36th European Solid-State Circuits Conference, ESSCIRC 2010, Sevilla, Spain, September 13-17, 2010. pages 9-16, IEEE, 2010. [doi]
Abstract is missing.