Raviteja P. Reddy, Amit Acharyya, S. Saqib Khursheed. A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. In IEEE International Test Conference in Asia, ITC-Asia 2019, Tokyo, Japan, September 3-5, 2019. pages 121-126, IEEE, 2019. [doi]
Abstract is missing.