Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography

M. Riccio, Lucio Rossi, Andrea Irace, E. Napoli, Giovanni Breglio, Paolo Spirito, R. Tagami, Y. Mizuno. Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography. Microelectronics Reliability, 50(9-11):1725-1730, 2010. [doi]

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