Raphael Robertazzi, Micheal Scheurman, Matt Wordeman, Shurong Tian, Christy Tyberg. Analytical test of 3D integrated circuits. In IEEE International Test Conference, ITC 2017, Fort Worth, TX, USA, October 31 - Nov. 2, 2017. pages 1-10, IEEE, 2017. [doi]
Abstract is missing.