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Thermal implications of mobile 3D-ICs

Mehdi Saedi, Kambiz Samadi, Arpit Mittal, Rajat Mittal. Thermal implications of mobile 3D-ICs. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-7, IEEE, 2014. [doi]

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