Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings

Miled Ben Salah, Daniel Pasquet, Frederic Voiron, Philippe Descamps, Jean Luc Lefebvre, Dominique Lesenechal. Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings. In 2013 IEEE Radio and Wireless Symposium, Austin, TX, USA, January 20-23, 2013. pages 304-306, IEEE, 2013. [doi]

Abstract

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