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Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Christoph Sander, Yvonne Standke, Sven Niese, Rüdiger Rosenkranz, André Clausner, Martin Gall, Ehrenfried Zschech. Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration. Microelectronics Reliability, 54(9-10):1959-1962, 2014. [doi]

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