Thermal performance of 3D ICs: Analysis and alternatives

Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis. Thermal performance of 3D ICs: Analysis and alternatives. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-7, IEEE, 2014. [doi]

Abstract

Abstract is missing.