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Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes

C. Santos, Pascal Vivet, Sebastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, L. Wang. Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-5, IEEE, 2016. [doi]

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