Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP

Ryohei Sato, Akihiro Tsukada, Yukihiro Sato, Yoshiharu Iwata, Hidenori Murata, Shigenobu Sekine, Ryuji Kimura, Keijiroh Kishi. Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

Abstract

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