Automatic die placement and flexible I/O assignment in 2.5D IC design

Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow. Automatic die placement and flexible I/O assignment in 2.5D IC design. In Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015. pages 524-527, IEEE, 2015. [doi]

@inproceedings{SeemuthDM15,
  title = {Automatic die placement and flexible I/O assignment in 2.5D IC design},
  author = {Daniel P. Seemuth and Azadeh Davoodi and Katherine Morrow},
  year = {2015},
  doi = {10.1109/ISQED.2015.7085480},
  url = {http://dx.doi.org/10.1109/ISQED.2015.7085480},
  researchr = {https://researchr.org/publication/SeemuthDM15},
  cites = {0},
  citedby = {0},
  pages = {524-527},
  booktitle = {Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015},
  publisher = {IEEE},
  isbn = {978-1-4799-7581-5},
}