Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow. Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 372-377, IEEE, 2017. [doi]
@inproceedings{SeemuthDM17,
title = {Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers},
author = {Daniel P. Seemuth and Azadeh Davoodi and Katherine Morrow},
year = {2017},
doi = {10.1109/ASPDAC.2017.7858351},
url = {http://dx.doi.org/10.1109/ASPDAC.2017.7858351},
researchr = {https://researchr.org/publication/SeemuthDM17},
cites = {0},
citedby = {0},
pages = {372-377},
booktitle = {22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017},
publisher = {IEEE},
isbn = {978-1-5090-1558-0},
}