Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers

Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow. Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 372-377, IEEE, 2017. [doi]

@inproceedings{SeemuthDM17,
  title = {Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers},
  author = {Daniel P. Seemuth and Azadeh Davoodi and Katherine Morrow},
  year = {2017},
  doi = {10.1109/ASPDAC.2017.7858351},
  url = {http://dx.doi.org/10.1109/ASPDAC.2017.7858351},
  researchr = {https://researchr.org/publication/SeemuthDM17},
  cites = {0},
  citedby = {0},
  pages = {372-377},
  booktitle = {22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017},
  publisher = {IEEE},
  isbn = {978-1-5090-1558-0},
}