A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications

Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, SeungBae Park. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors, 17(2):322, 2017. [doi]

Abstract

Abstract is missing.