Kele Shen, Dong Xiang, Zhou Jiang. Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2014, Tampa, FL, USA, July 9-11, 2014. pages 208-213, IEEE, 2014. [doi]
Abstract is missing.