Bing Shi, Ankur Srivastava, Avram Bar-Cohen. Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2012, Amherst, MA, USA, August 19-21, 2012. pages 33-38, IEEE, 2012. [doi]
Abstract is missing.