Akitsu Shigetou, Tilo H. Yang, C. Robert Kao. Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-3, IEEE, 2019. [doi]
Abstract is missing.