Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards

Sam Siau, Johan De Baets, André Van Calster, Leon Heremans, Sammy Tanghe. Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. Microelectronics Reliability, 45(3-4):675-687, 2005. [doi]

Abstract

Abstract is missing.