CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems

Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda. CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. TACO, 19(3), 2022. [doi]

Abstract

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