Analytical Modeling of 3D Stacked IC Yield from Wafer to Wafer Stacking with Radial Defect Clustering

Eshan Singh. Analytical Modeling of 3D Stacked IC Yield from Wafer to Wafer Stacking with Radial Defect Clustering. In 2014 27th International Conference on VLSI Design and 2014 13th International Conference on Embedded Systems, Mumbai, India, January 5-9, 2014. pages 26-31, IEEE, 2014. [doi]

Abstract

Abstract is missing.