Shiv Govind Singh, Chuan Seng Tan. Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]
Abstract is missing.