Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout. Packaging and Assembly Challenges for 50G Silicon Photonics Interposers. In Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, CA, USA, March 11-15, 2018. pages 1-3, IEEE, 2018. [doi]
Abstract is missing.