LLM-Design Platform for Thermal-Failure-Aware 3D Chiplet Layout via Iterative Parameter Analysis

Tai Song, Senling Wang, Xiaoqing Wen. LLM-Design Platform for Thermal-Failure-Aware 3D Chiplet Layout via Iterative Parameter Analysis. In 34th IEEE Asian Test Symposium, ATS 2025, Tokyo, Japan, December 16-19, 2025. pages 55-60, IEEE, 2025. [doi]

Abstract

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