P. M. Souare, François de Crecy, Vincent Fiori, H. Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, A. Borbely, J.-P. Colonna, P. Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, J. Michailos. Thermal correlation between measurements and FEM simulations in 3D ICs. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
Abstract is missing.