Pulse plated silver metallization on porosified LTCC substrates for high frequency applications

Frank Steinhäußer, Armin Talai, Gabriela Sandulache, Robert Weigel, Alexander Koelpin, Wolfgang Hansal, Achim Bittner, Ulrich Schmid. Pulse plated silver metallization on porosified LTCC substrates for high frequency applications. Microelectronics Reliability, 60:93-100, 2016. [doi]

Abstract

Abstract is missing.