Tadatomo Suga, Ryuichi Kondoh. Low temperature bonding for 3D interconnects. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
Abstract is missing.