Solderless bonding with nanoporous copper as interlayer for high-temperature applications

Siyu Sun, Qiang Guo, Hongtao Chen, Mingyu Li, Chunqing Wang. Solderless bonding with nanoporous copper as interlayer for high-temperature applications. Microelectronics Reliability, 80:198-204, 2018. [doi]

Abstract

Abstract is missing.