Makoto Suwada, Kazuhiro Kanai. Considerations of TSV effects on next-generation super-high-speed transmission and power integrity design for 300A-class 2.5D and 3D package integration. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
Abstract is missing.