Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing

Y. Y. Tan, Q. L. Yang, K. S. Sim, Li Tao Sun, Xing Wu. Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing. Microelectronics Reliability, 55(11):2316-2323, 2015. [doi]

Abstract

Abstract is missing.