Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories

Mottaqiallah Taouil, Said Hamdioui. Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories. In 16th European Test Symposium (ETS 2011), May 23-27, 2011, Trondheim, Norway. pages 45-50, IEEE Computer Society, 2011. [doi]

Abstract

Abstract is missing.