Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost

Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. J. Electronic Testing, 28(1):15-25, 2012. [doi]

Abstract

Abstract is missing.