Impact of mid-bond testing in 3D stacked ICs

Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen, Sudipta Bhawmik. Impact of mid-bond testing in 3D stacked ICs. In 2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2013, New York City, NY, USA, October 2-4, 2013. pages 178-183, IEEE, 2013. [doi]

Abstract

Abstract is missing.