On maximizing the compound yield for 3D Wafer-to-Wafer stacked ICs

Mottaqiallah Taouil, Said Hamdioui, Jouke Verbree, Erik Jan Marinissen. On maximizing the compound yield for 3D Wafer-to-Wafer stacked ICs. In Ron Press, Erik H. Volkerink, editors, 2011 IEEE International Test Conference, ITC 2010, Austin, TX, USA, November 2-4, 2010. pages 183-192, IEEE, 2010. [doi]

Abstract

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