Kotaro Terada, Daisuke Oku, Sho Kanamaru, Shu Tanaka, Masato Hayashi, Masanao Yamaoka, Masao Yanagisawa, Nozomu Togawa. An Ising model mapping to solve rectangle packing problem. In 2018 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), Hsinchu, Taiwan, April 16-19, 2018. pages 1-4, IEEE, 2018. [doi]
Abstract is missing.