Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, Christian Koos. 3D-Printed Optics for Wafer-Scale Probing. In European Conference on Optical Communication, ECOC 2018, Rome, Italy, September 23-27, 2018. pages 1-3, IEEE, 2018. [doi]
@inproceedings{TrappenBDHXBFK18,
title = {3D-Printed Optics for Wafer-Scale Probing},
author = {Mareike Trappen and Matthias Blaicher and Philipp-Immanuel Dietrich and Tobias Hoose and Yilin Xu and Muhammad Rodlin Billah and Wolfgang Freude and Christian Koos},
year = {2018},
doi = {10.1109/ECOC.2018.8535123},
url = {https://doi.org/10.1109/ECOC.2018.8535123},
researchr = {https://researchr.org/publication/TrappenBDHXBFK18},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {European Conference on Optical Communication, ECOC 2018, Rome, Italy, September 23-27, 2018},
publisher = {IEEE},
isbn = {978-1-5386-4862-9},
}