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H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T.-Y. Chung, C. Y. Liu. Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces. Microelectronics Reliability, 50(8):1159-1162, 2010. [doi]
Abstract is missing.