Low-Power and High-Throughput Architecture for 3D-HEVC Depth Modeling Mode 4

Mariana Ucker, Vladimir Afonso, Luan Audibert, Altamiro Amadeu Susin, Bruno Zatt, Marcelo Schiavon Porto, Luciano Volcan Agostini. Low-Power and High-Throughput Architecture for 3D-HEVC Depth Modeling Mode 4. In 31st Symposium on Integrated Circuits and Systems Design, SBCCI 2018, Bento Gonçalves, RS, Brazil, August 27-31, 2018. pages 1-6, IEEE, 2018. [doi]

Abstract

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