Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM

Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida. Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-4, IEEE, 2020. [doi]

Abstract

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