Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sebastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot. Opportunities brought by sequential 3D CoolCube™ integration. In 46th European Solid-State Device Research Conference, ESSDERC 2016, Lausanne, Switzerland, September 12-15, 2016. pages 226-229, IEEE, 2016. [doi]
@inproceedings{VinetBFBMLDMPBR16,
title = {Opportunities brought by sequential 3D CoolCube™ integration},
author = {Maud Vinet and Perrine Batude and Claire Fenouillet-Béranger and Laurent Brunet and Vincent Mazzocchi and Cao-Minh Vincent Lu and Fabien Deprat and Jessy Micout and Bernard Previtali and Paul Besombes and Nils Rambal and François Andrieu and Olivier Billoint and Melanie Brocard and Sebastien Thuries and Guillaume Berhault and Cristiano Lopes Dos Santos and Gerald Cibrario and Fabien Clermidy and Daniel Gitlin and Olivier Faynot},
year = {2016},
doi = {10.1109/ESSDERC.2016.7599627},
url = {http://dx.doi.org/10.1109/ESSDERC.2016.7599627},
researchr = {https://researchr.org/publication/VinetBFBMLDMPBR16},
cites = {0},
citedby = {0},
pages = {226-229},
booktitle = {46th European Solid-State Device Research Conference, ESSDERC 2016, Lausanne, Switzerland, September 12-15, 2016},
publisher = {IEEE},
isbn = {978-1-5090-2969-3},
}