Osamu Wada, Toshimasa Namekawa, Hiroshi Ito, Atsushi Nakayama, Shuso Fujii. Post-Packaging Auto Repair Techniques for Fast Row Cycle Embedded DRAM. In Proceedings 2004 International Test Conference (ITC 2004), October 26-28, 2004, Charlotte, NC, USA. pages 1016-1023, IEEE, 2004. [doi]
Abstract is missing.